From September 10th to 12th, 2025, Smartwin Semiconductor will make a grand appearance at SEMI-e Shenzhen International Semiconductor Exhibition (Booth No.: 16E46). We will showcase our company's innovative achievements and technological strength, and look forward to gathering and exchanging ideas with industry peers to jointly promote industrial development.
Servo actuator
Product Introduction：
This product adopts advanced electromagnetic design and material technology, featuring ultra-high precision, high reliability and long service life. It is specially designed for high-precision semiconductor manufacturing processes such as wafer processing, packaging and testing, and lithography machines, meeting the requirements of harsh industrial environments.
Product Features：
High speed and high response: Adopting low-vibration and low-noise design to ensure nanoscale motion control, it is suitable for semiconductor equipment with extremely high positioning accuracy requirements.
Backlash-free and high rigidity: Special sealing structure and anti-corrosion materials effectively resist chemical gases and particle contamination in semiconductor manufacturing, ensuring long-term stable operation.
Application Conditions：
Highly rotating structures such as wafer coating, developing, cleaning and etching.
AOI marble inspection platform
Product Introduction：
This platform is specially designed for AOI (Automatic Optical Inspection) of high-end semiconductor wafer inspection equipment. It integrates high-performance linear motors with a natural high-precision marble base, forming a core motion system that achieves ultra-precision positioning and stable load-bearing. It is suitable for 2-12 inch wafer inspection.
Product Features：
Ultimate stability, safety and reliability: Adopting a marble base to maintain high precision and stability.
High speed, high precision and high response: Equipped with linear motors and high-precision reading heads, with a repeatability of ±0.5μm and a compensated accuracy of ±1μm.
Application Conditions：
High-end wafer defect inspection (AOI): The platform is required to maintain extremely high motion stability and positioning accuracy when scanning large-area wafers at high speed, so as to avoid misjudgment or missed detection of defects caused by platform vibration or positioning deviation.
YASKAWA MR124E Wafer Robot + PER1130 Edge Finder
Product Introduction：
MR124E Wafer Robot: A high-cleanliness SCARA robot specifically designed for high-speed transfer of 12-inch wafers, meeting Class 1 clean environment standards.
PER1130 Wafer Edge Finder: Integrating high-precision optical sensors, it achieves wafer center positioning and Notch/Flat edge detection with a positioning accuracy of ±0.05mm. The intelligent collaboration between the two machines builds an integrated platform for automated wafer transfer and precise positioning.
Product Features：
Application Conditions：
High speed and high precision: The repeat positioning accuracy reaches ±0.1mm, and the Aligner accuracy reaches ±0.03°;
Ultra-clean design: Strictly compliant with Class 1 (ISO Class 3);
SR8220 Series Wafer Robot
Product Introduction：
The SR8220 Series Wafer Robot is a high-performance wafer transfer solution specifically designed for harsh clean environments such as semiconductor manufacturing, advanced packaging, and compound semiconductors. As a core equipment for wafer handling in atmospheric environments, it adopts advanced motion control technology and precision mechanical structure, enabling efficient, accurate and reliable handling of 2-12 inch wafers. It meets the urgent needs of modern fabs for automation, high throughput and yield improvement, and also provides customized services.
Product Features：
High speed and high precision: Repeat positioning accuracy reaches ±0.1mm.
Ultra-clean design: Strictly compliant with Class 1 (ISO Class 3).
High efficiency and compatibility: Compatible with handling 2-12 inch wafers, adopting a 2ARM structure to achieve high-level transfer and dual-wafer picking and placing.
Application Conditions：
Semiconductor wafer handling in atmospheric environments, suitable for wafer loading/unloading and inter-machine transfer in various semiconductor equipment, EFEM, Sorter, coating and developing equipment, cleaning equipment, etc.
Wafer Equipment Front-End Module SMA4000（EFEM）
Product Introduction：
SMA4400-W12-001 is an EFEM (Equipment Front End Module) developed for 3000mm wafers. It integrates 4 high-precision Load Ports and one multi-axis robot SR8241, enabling fully automatic and high-speed transfer of wafers from FOUP to process equipment. It constructs a Class 1 ultra-clean environment and provides customized services.
Product Features：
Precise and efficient: The SR8241 series robot offers a repeat positioning accuracy of ±0.005mm.
4LP parallel processing: Increases UPH by 40%.
Flexible and reliable: Modular design, compatible with AMHS/multiple equipment interfaces, and featuring fault self-diagnosis, reducing MTTR by 30%. Intelligent control with SECS/GEM communication protocol support for real-time data monitoring and preventive maintenance.
Application Conditions：
Mass production fabs, packaging and testing production lines, third-generation semiconductors, R&D laboratories.
