Gluing And Developing
Gluing And Developing
Grinding And Thinning
Grinding And Thinning
Clear Coating
Clear Coating
High Temperature Furnace Tube
High Temperature Furnace Tube
Bonding Etching
Bonding Etching
Testing Equipment
Testing Equipment
Application process of NIDEC dual arm wafer robot in high-temperature furnace tube equipment
Application process of NIDEC dual arm wafer robot in high-temperature furnace tube equipment

Application process of NIDEC dual arm wafer robot in high-temperature furnace tube equipment

Industry
NIDEC Dual Arm Wafer Robot Process for High Temperature Furnace Tube Equipment Applications
Device Name
NIDEC Dual Arm Wafer Robot
Industry Application
High-speed handling of semiconductor wafers in atmospheric environments. Suitable for use in various semiconductor equipment, such as EFEMs, sorters, adhesive coating and developing equipment, cleaning equipment, and testing equipment.
Program Features
Using NIDEC dual arm wafer robot, Simultaneous pick and place of 6 or 10 wafers with fingers, Compatible with 4-12" wafers, Customised design to meet high stroke requirements

Plan details

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