Gluing And Developing
Gluing And Developing
Grinding And Thinning
Grinding And Thinning
Clear Coating
Clear Coating
High Temperature Furnace Tube
High Temperature Furnace Tube
Bonding Etching
Bonding Etching
Testing Equipment
Testing Equipment
Application Plan of Dual Arm SR8220-1023 Robot in Gluing and Developing Equipment Process
Application Plan of Dual Arm SR8220-1023 Robot in Gluing and Developing Equipment Process
Application process plan of uniform adhesive DD motor in adhesive coating and developing equipment
Application process plan of uniform adhesive DD motor in adhesive coating and developing equipment

Application Plan of Dual Arm SR8220-1023 Robot in Gluing and Developing Equipment Process

Industry
Gluing and Developing Application Processes
Device Name
Gluing and Developing Equipment Process
Industry Application
High-speed handling of semiconductor wafers in atmospheric environments. Suitable for use in various semiconductor equipment, such as EFEMs, sorters, adhesive coating and developing equipment, cleaning equipment, and testing equipment.
Program Features
NIDEC's dual arm SR8220-1023 robot, vacuum attached ceramic fingers, compatible with 4-12" wafers, can be configured for both opposed and reflected mapping.

Plan details

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