Application of SR8241-3101 Robot in Grinding and Thinning Equipment Process
Industry
SR8241-3101 Robot in grinding and thinning equipment process applications
Device Name
SR8241-3101 robot
Industry Application
High-speed handling of semiconductor wafers in atmospheric environments for cleaning, coating, grinding, etching and other semiconductor equipment, EFEM modules, testing equipment, etc.
Program Features
Large transport range design
Independent dual drive system enables simultaneous pick and place of 2 tablets.
Compact design with small footprint
Supports vacuum clamping and gripping of pick and place tablets.
Multi-functional and rotatable arm
3-section ARM without travelling axes, corresponding to 4 Loadport in parallel.
