Single Arm Flip Axis Wafer Robot

Single Arm Flip Axis Wafer Robot

Customizable
 

Using a servo motor as the flipping axis

The flipping axis can adjust the speed according to requirements

Servo motor absolute value encoder

Can achieve vacuum adsorption, clamping, and Bernoulli flipping;

Flexible structure, capable of flipping both single and double arms

The suitable wafer manufacturing processes for flip axis wafer robots include: wafer coating, film application, laser marking, cleaning, grinding, debonding, development, etching, etc

Online Consultation
400-019-0100
Service Hotline
Technical Parameter
Dimensional Structure
Chip Sensor
Data Catalog
CAD Drawings
Instructions
ProjectSpecification
Structure5-axis (using AC servo motor and ABS encoder)      Z-axis: motor with brake
Wafer Size2-inch to 12 inch wafers
Scope of SorkR1 axis-302-+321mm
R2 axis-302-+321mm
Z-axis300mm/500mm
Flip axis-10-180deg
θ axis340deg
Maximum SpeedR1 axis5.76 rad/sec
R2 axis5.76 rad/sec
Z-axis450 mm/sec
θ axis6.97 rad/sec
Finger Spacing60mm/80mm
Maximum Effective Load1kg (including the weight of the finger)
Repetitive Accuracy± 0.1mm (based on ISO 9283)
Body Weight80kg
Cleanliness LevelISO Class1
Noise Level
80 decibels or lower
Dielectric StrengthAC 1500V, lasting for 1 minute (between the main power supply and the ground)
insulation Resistance
1M Qor or above (DC500V)
Robot Materialaluminium alloy
EE (End Effector)Ceramics, carbon fiber, aluminum alloy, etc. (customized according to requirements)
Working VoltageAC220V (1.2KVA), DC24V (1.2A), DC48V (3A)
Communication Methods
EtherNet/RS232
Gas Source
Positive pressure: 0.4~0.5MPa& Nbsp; Negative pressure: below -70KPa
ControllerSC5000

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