EFEM Wafer Robot

EFEM Wafer Robot

SR8241-3101
 

Design of large transportation range

Independent dual drive system to achieve simultaneous retrieval and retrieval of two pieces

Compact construction with small footprint

Supports vacuum adsorption and clamping for taking and placing tablets

Featuring multifunctional and rotatable arms

3-segment ARM does not require a profile axis, corresponding to 4 parallel loadports arranged in parallel

SR8241 series robot industry application: high-speed handling of semiconductor wafers in atmospheric environments, used for cleaning, coating, grinding, etching and other semiconductor equipment, EFEM modules, testing equipment, etc

Online Consultation
400-019-0100
Service Hotline
Technical Parameter
Dimensional Structure
Data Catalog
CAD Drawings
Instructions
ProjectSpecification
Wafer Size5-axis (using AC servo motor and ABS encoder)      Z-axis: motor with brake
Scope of Work8-inch to 12 inch wafers
Scope of WorkFlip Axis (deg) Roll1/2AXIS+/-275
X-axis (mm) X AXIS-750-+750
Z-axis (mm); Z AXIS
four hundred and seventy
θ Theme AXIS
&Nbsp+/- one hundred and seventy
MaximumSpeedFlip Axis (rag/sec) Roll1/2AXISnine point four two
X-axis (rag/sec)  X  AXIS2.44 (1952mm/sec)
Z-axis (rag/sec) & Nbsp; Z AXISseven hundred and twenty
θ Axis (rag/sec)  Thete  AXISsix point five four
Finger Spacing10mm
Maximum Handling Weight2kg
Repetitive Accuracy+/-0.05mm
Body Weight70kg
Noise Level80 decibels or lower
Dielectric StrengthAC 1500V, continuous for 1 minute (between the main power supply and ground)
Insulation Resistance
1M Qor or above (DC500V)
Robot Materialaluminium alloy
Finger Type
Vacuum adsorption/clamping structure
Finger Material
Ceramics, carbon fiber, aluminum alloy, etc. (customized according to requirements)
Working Voltage
AC220V (1.2KVA), DC24V (1.2A), DC48V (3A)
Communication Methods
EtherNet/RS232
ControllerSC5000

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