Wafer Handling Front-end Module

Wafer Handling Front-end Module

SMA1000-W8-001
 

The SMA1000-W8-001 fully automatic wafer handling system is a semiconductor equipment front-end module developed for 200mm wafers.

Internally, multi axis robots are used to transfer chips, improving efficiency.

Use vacuum adsorption to remove and place chips, ensuring their cleanliness.

Online Consultation
400-019-0100
Service Hotline
Technical Parameter
Dimensional Structure
Data Catalog
CAD Drawings
Instructions
ProjectSpecification
External Dimensions
 1120 * 1390 * 2250mm
Equipment Weight
1550Kg
Wafer Specifications
200mm
Number of LoadPorts2 sets
FOUP Specifications200mm (SEMI Std. Product)
Scanning Functionhave
Wafer Edge Finder
1 set
OHT Protectionnothing
Internal LightingLED lighting
Top FFU1 set
Electrostatic Eliminator2 sets
UPS Power Supply Unit1 set
Cleanliness LevelISO Class 1
Signal Lights
Tricolor lamp
Mechanical ArmSingle arm with flipping
Wafer Carrier TypeVacuum adsorption
Control System
Personal computer, 21.5 "display screen, Win10 system
Vacuum (Pressure Source)- 70Kpa~-100Kpa
Compressed Air
 0.5Mpa~0.8Mpa
Total Power~ 3Kw
Power Supply
 AC 200-240V, 50/60Hz;
work Environment
Temperature: 5-40 ℃ Humidity: 30-80%
Shipping Method Whole machine shipment



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