Wafer Handling Robot

Wafer Handling Robot

SR8220-1023
 

The use of 2ARM construction has increased the range of transportation

Realize high-speed transmission of wafers and dual chip simultaneous retrieval and placement

Ensuring ultra-high straight-line accuracy

Various combinations of ARM and Z-axis can meet the needs of corresponding devices

Can be used for wafer transport of 2-12 inches at the same time

The SR8220 series wafer robots are used for high-speed handling of semiconductor wafers in atmospheric environments, suitable for various semiconductor equipment, EFEM, sorter, adhesive development equipment, cleaning equipment, testing equipment, etc

Online Consultation
400-019-0100
Service Hotline
Technical Parameter
Dimensional Structure
Chip Sensor
Data Catalog
CAD Drawings
Instructions
ProjectSpecification
Structure
4-axis (using AC servo motor and ABS encoder)          Z-axis: motor with brake
Wafer size2-inch to 12 inch wafers
Scope of WorkR1 axis-302-+321mm
R2 axis-302-+321mm
Z-axis500mm
θ axis340deg
Maximum SpeedR1 axis5.76 rad/sec
R2 axis5.76 rad/sec
Z-axis450 mm/sec
θ axis6.97 rad/sec
Arm Spacing25mm/45mm
Maximum Effective Load1kg (including weight of fingers)
Repetitive Accuracy± 0.1mm (based on ISO 9283)
Body Weight80kg
Cleanliness LevelISO Class1
Noise Level
80 decibels or lower
Dielectric StrengthAC 1500V, lasting for 1 minute (between the main power supply and the ground)
insulation Resistance
1M Qor or above (DC500V)
Robot Materialaluminium alloy
EE (End Effector)Ceramics, carbon fiber, aluminum alloy, etc. (customized according to requirements)
Working VoltageAC220V (1.2KVA), DC24V (1.2A)
Communication Methods
EtherNet/RS232
Gas Source
Positive pressure: 0.4~0.5MPa Negative pressure: below -70KPa
ControllerSC5000

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